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| MAX1555EZK Rev. A RELIABILITY REPORT FOR MAX1555EZK PLASTIC ENCAPSULATED DEVICES August 28, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX1555 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments I. Device Description A. General The MAX1555 charges a single-cell lithium-ion (Li+) battery from both USB* and AC adapter sources. It operates with no external FETs or diodes, and accept operating input voltages up to 7V. On-chip thermal limiting simplifies PC board layout and allows optimum charging rate without the thermal limits imposed by worst-case battery and input voltage. When the MAX1551 thermal limits are reached, the charger does not shut down, but progressively reduces charging current. The MAX1555 includes a POK-bar output to indicate when input power is present. The MAX1555 features a CHG-bar output to indicate charging. With USB connected, but without DC power, charge current is set to 100mA (max). This allows charging from both powered and unpowered USB hubs with no port communication required. When DC power is connected, charging current is set at 280mA (typ). No input-blocking diodes are required to prevent battery drain. The MAX1555 is available in 5-pin thin SOT23 packages and operates over a -40C to +85C range. B. Absolute Maximum Ratings Item DC to GND DC to BAT BAT, CHG, POK, USB to GND Operating Temperature Range Junction Temperature Range Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70C) 5-Pin Thin SOT23 Derates above +70C 5-Pin Thin SOT23 Rating 0 to +8V 0 to +7V -0.3V to +7V -40C to +85C -40C to +150C -65C to +150C +300C 727mW 9.1mW/C II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: SOT23 Dual-Input USB/AC Adapter 1-Cell Li+ Battery Charger B8 - Standard 8 micron silicon gate CMOS 541 California, USA Philippines June, 2003 III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: 5-Lead SOT23 Copper Solder Plate Silver-filled Epoxy Gold (1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-9000-0523 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 59 X 40 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) TiW/ AlCu/ TiWN None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 192 x 4389 x 48 x 2 (Chi square value for MTTF upper limit) Temperature Acceleration factor assuming an activation energy of 0.8eV = 22.62 x 10-9 = 22.62 F.I.T. (60% confidence level @ 25C) This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The Burn-In Schematic (Spec.# 06-6146) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located on the Maxim website at http://www.maxim-ic.com . B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. B. E.S.D. and Latch-Up PN20-1 die type has been found to have all pins able to withstand a transient pulse of 1000V, per Mil-Std883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA. Table 1 Reliability Evaluation Test Results MAX1555EZK TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 48 0 DC Parameters & functionality 77 0 85/85 DC Parameters & functionality 77 0 Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters & functionality 77 0 Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic process/package data Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. c. TERMINAL C R1 S1 R2 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT CURRENT PROBE (NOTE 6) TERMINAL B R = 1.5k C = 100pf Mil Std 883D Method 3015.7 Notice 8 TERMINAL D ONCE PER SOCKET ONCE PER BOARD +10V 160 K (1%) 1 NC NC 8 300 Ohms (1%) 2 DC BAT 7 1 uF (10V) 100 Ohms (1%) 3 GND GND 6 1 uF (10V) 4 POKB/CHGB USB 40 K (1%) 5 600 Ohms (1%) 1 uF (10V) 100 K (1%) DEVICES: MAX 1551ESA/1555ESA (PN20Z) PACKAGE: 8-NSO MAX. EXPECTED CURRENT = 12mA DRAWN BY: TEK TAN NOTES: DOCUMENT I.D. 06-6146 REVISION B MAXIM TITLE: BI Circuit (MAX1551/1555) PN20Z PAGE 2 |
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